- Manual equipment for laboratory (Variety of materials are available)
- Wafer bonding equipment for heterogeneous / homogeneous materials
- Technology that enables high performance by Wafer integration

• Machine Type : Manual
• Wafer Size : Up to 6 inch (Option applicable 8 inch)
• Wafer Type : Si, Sapphire, GaAs, GaN and so on.
• Bonding method : Eutectic, Adhesive, Epoxy, Polymer
• Main module : EFEM, Transfer, Stacker, Pre Aligner, Fine Aligner, Process module
• Wafer Loading to PM Qty : 1 Wafer/PM Loading
• Application : Micro LED, Mini LED, FBAR Filter, SAW Filter, CMOS Image Sensor, MEMS, Semiconductor, Acceleration Sensor, Vertical LED