Business
HUTEM
Semiconductor
WLP(Wafer Level Package) Process Service
Wafer level bonding process service applied to semiconductor / display manufacturing
Process Specification
| Type | Contents |
|---|---|
| Wafer Size | Piece ~ 8 inch |
| Type of Wafer | Si,m Sapphire, Glass, GaN, GaAs |
| Bonding Method | Eutetic, Adhesive, Epoxy, Polymer |
| Bonding Method | Up to 400℃(752℉) |
| Pressure | 10 ~ 20,000kgf |
| Align Type | Inner Side Align (ISA with Real Time Align) |
Application
MicroLED, MiniLED, FBAR filter, SAW filter, CIS, Vertical LED, Acceleration sensor, Piezoelectric, Solar cell, etc.
Foundry Process
Equipment List for Foundry Service
Aligner
Plasma Asher
Laser module for Pre-Bonding
Hot Plate
Oven
Bonder
Spin Coater
하단영역
Address : #302 115, Gasan digital 2-ro, Geumcheon-gu, Seoul, Korea
Tel : +82-2-855-2277
Fax : +82-2-855-2276
E-mail : hutem_sales@hutem.co.kr
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