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Business
HUTEM

Semiconductor

HBS-800A

HBS-800A

- Optimized equipment for mass production
- Extended Cluster Type of Process Module for improving production capacity
- Wafer bonding equipment for heterogeneous / homogeneous materials
- Technology that enables high performance by Wafer integration

  • Machine Type : Full-Automation
  • Wafer Size : 8inch(Option: 12inch)
  • Wafer Type : Si, Sapphire, GaAs, GaN and so on.
  • Bonding method : Eutectic, Adhesive, Epoxy, Polymer
  • Main module : EFEM, Transfer, Stacker, Pre Aligner, Fine Aligner, Process module
  • Process Module docking : Max. 4 PM Extensible
  • Wafer Loading to PM Qty : 1 Wafer/PM Loading
  • Application : Micro LED, Mini LED, FBAR Filter, SAW Filter, CMOS Image Sensor, MEMS, Semiconductor, Acceleration Sensor, Vertical LED