본문 바로가기 주메뉴 바로가기
Company
HUTEM

History·Reference

2022

  • Exported prefilled syringe assembly machine (HAS-4000) and Denester to Taiwan
  • Contracted for prefilled syringe filling machine delivery with Russian pharmaceutical company
  • Launched HFS-6000 prefilled syringe machine (5,10 Lane)

2021

  • Launched HFS-6000 prefilled syringe machine (5,10 Lane)
  • Launched HAS-6000 prefilled syringe assembly machine
  • GaAs to Si Bonding Foundry service

2020

  • Launched Covid-19 specimen collection kit filling machine
  • Launched imported Vial line and prefilled syringe assembly machine
  • Delivered Anodic Semi-Auto Wafer Bonder to KOPTI(Korea Photonics Technology Institute)
  • uLed WL(Wafer-Level) Transfer Bonding Foundry service

2019

  • Exceeded 50 Pharmaceutical projects
  • Launched prefilled syringe filling machine applied Closing Needle for ultra-high viscosity filler
  • Launched prefilled syringe filling machine HFS-300 for small production volume
  • Vibration & Acoustic Transducer Bonding Foundry service
  • uLED Bonding Foundry service
  • Micro-LED technical development (special Jig)
  • Apply for a patent (Substrates bonding device)

2018

  • Launched prefilled syringe filling machine HFS-5000
  • Launched prefilled syringe filling machine with CIP/SIP
  • Solar cell Bonding Foundry service
  • Acquired patent for the substrate bonding method to using substrate Pre-bonding device
  • Acquired patent for the Silicon Substrate direct bonding method and Silicon substrate direct bonding device of align parts verification method
  • FBAR Filter Bonding Foundry service

2017

  • Acceleration sensor Bonding Foundry service
  • SAW Filter Bonding Foundry service
  • Started foundry service for wafer bonding process service

2016

  • agreed to agent contract with Allpharm Technology (India)
  • agreed to agent contract with Pharmcontract (Russia)
  • Successful development of “12” W2W Direct bonding system using Wafer surface hydrophilic plasma activation“ by government agency project
  • Acquired patent for the device for manufacturing replica stamp and method for manufacturing replica stamp 

2015

  • Launched Prefilled syringe filling machine HFS-4000
  • Launched Prefilled syringe assembly machine HAS-4000
  • Acquired patent for the Imprint device using fluid pressure, Imprint method
  • Acquired patent for the Substrates bonding device using fluid pressure and Substrates bonding method
  • Acquired patent for the Wafer Bonder with holder and wafer bonding method
  • Acquired patent for the Wafer bonder, Wafer bonding device and bonding method using plasma activation process

2014

  • Successful development of “8 inch large area SCIL stamp production facilities and process methods including master and replica stamp surface treatment devices“ by government agency project
  • Delivered mass production type of Wafer Bonder to S company(8 Inch)
  • Delivered Wafer Bonder for laboratory to S Research Center(4 Inch)
  • Delivered Manual Wafer Bonder for laboratory to Y Research Center (6 Inch)

2013

  • Moved into Seoul office and plant
  • Acquired patent for the Wafer Bonder using electromagnetic wave heating
  • Acquired patent for the Wafer Bonder using dual-cooling and Wafer bonding method

2012

  • Successful development of “Wafer bonder for vertical LEDs applied to large area Substrates .” by government agency project
  • Acquired patent for the device for correction position of Wafer, Wafer bonder and Jig for Wafer bonder
  • Delivered mass production type of Wafer Bonder to N company(8 Inch)

2011

  • selected as a member of InnoBiz

2009

  • selected as a venture company and obtained ISO 9001 certification
  • started R&D of pharmaceutical/medical equipment
  • Delivered mass production type of Wafer Bonder to K company(4 Inch)
  • Delivered Wafer Bonder for laboratory to S Research Center(8 Inch)
  • Delivered mass production type of Full Auto Wafer Bonder to S company(4 Inch)
  • Acquired patent for the Wafer bonder and Imprint device

2008

  • Delivered semiconductor R&D Equipment

2007

Hutem was established

  • Developed Wafer Bonding & Nano Imprinting machine
  • Acquired patent for the Transparent sheet heater and method for manufacturing
  • Developed mass production type Wafer Bonder to S company

Reference