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Company
HUTEM

History·Reference

2021

  • GaAs to Si Bonding Foundry service

2020

  • Delivered Anodic Semi-Auto Wafer Bonder to KOPTI(Korea Photonics Technology Institute)
  • uLed WL(Wafer-Level) Transfer Bonding Foundry service

2019

  • Vibration & Acoustic Transducer Bonding Foundry service
  • uLED Bonding Foundry service
  • Micro-LED technical development (special Jig)
  • Apply for a patent (Substrates bonding device)

2018

  • Solar cell Bonding Foundry service
  • Acquired patent for the substrate bonding method to using substrate Pre-bonding device
  • Acquired patent for the Silicon Substrate direct bonding method and Silicon substrate direct bonding device of align parts verification method
  • FBAR Filter Bonding Foundry service

2017

  • Acceleration sensor Bonding Foundry service
  • SAW Filter Bonding Foundry service
  • Started foundry service for wafer bonding process service.

2016

  • Successful development of “12” W2W Direct bonding system using Wafer surface hydrophilic plasma activation by government agency project
  • Acquired patent for the device for manufacturing replica stamp and method for manufacturing replica stamp

2015

  • Acquired patent for the Imprint device using fluid pressure, Imprint method
  • Acquired patent for the Substrates bonding device using fluid pressure and Substrates bonding method
  • Acquired patent for the Wafer Bonder with holder and wafer bonding method
  • Acquired patent for the Wafer bonder, Wafer bonding device and bonding method using plasma activation process

2014

  • Successful development of “8 inch large area SCIL stamp production facilities and process methods including master and replica stamp surface treatment devices” by government agency project
  • Delivered mass production type of Wafer Bonder to S company(8 Inch)
  • Delivered Wafer Bonder for laboratory to S Research Center(4 Inch)
  • Delivered Manual Wafer Bonder for laboratory to Y Research Center (6 Inch)

2013

  • Acquired patent for the Wafer Bonder using electromagnetic wave heating
  • Acquired patent for the Wafer Bonder using dual-cooling and Wafer bonding method

2012

  • Successful development of “Wafer bonder for vertical LEDs applied to large area Substrates .” by government agency project
  • Acquired patent for the device for correction position of Wafer, Wafer bonder and Jig for Wafer bonder
  • Delivered mass production type of Wafer Bonder to N company(8 Inch)

2009

  • Delivered mass production type of Wafer Bonder to K company(4 Inch)
  • Delivered Wafer Bonder for laboratory to S Research Center(8 Inch)
  • Delivered mass production type of Full Auto Wafer Bonder to S company(4 Inch)
  • Acquired patent for the Wafer bonder and Imprint device

2008

  • Delivered semiconductor R&D Equipment

2007

  • Developed Wafer Bonding & Nano Imprinting machine
  • Acquired patent for the Transparent sheet heater and method for manufacturing
  • Developed mass production type Wafer Bonder to S company

Reference