-可以适用各种样品的LAB用pilot设备
-可以适用为了提高生产量的扩张型PM模块
-异类或者同类的物质之间的晶片接合设备
-维持异类物质的优点实现wafer integration可以做高性能的技术

• Machine Type : Semi-Automation
• Wafer Size : Up to 8 inch
• Wafer Type : Si, Sapphire, GaAs, GaN and so on.
• Bonding method : Eutectic, Adhesive, Epoxy, Polymer
• Main module : EFEM, Transfer, Stacker, Pre Aligner, Fine Aligner, Process module
• Process Module docking : Max. 2 PM Extensible
• Wafer Loading to PM Qty : 1 Wafer/PM Loading
• Application : Micro LED, Mini LED, FBAR Filter, SAW Filter, CMOS Image Sensor, MEMS, Semiconductor, Acceleration Sensor, Vertical LED