HBS-400A
- 适用于大量生产的设备
-可以适用为了提高生产量的扩张型PM模块
-异类或者同类的物质之间的晶片接合设备
-维持异类物质的优点实现wafer integration可以做高性能的技术
- Machine Type : Full-Automation
- Wafer Size : 4inch(Option: 6.2inch)
- Wafer Type : Si, Sapphire, GaAs, GaN and so on.
- Bonding method : Eutectic, Adhesive, Epoxy, Polymer
- Main module : EFEM, Transfer, Stacker, Pre Aligner, Fine Aligner, Process module
- Process Module docking : Max. 3 PM Extensible
- Wafer Loading to PM Qty : 3 Wafers/PM Loading
- Application : Micro LED, Mini LED, FBAR Filter, SAW Filter, CMOS Image Sensor, MEMS, Semiconductor, Acceleration Sensor, Vertical LED