- Optimized equipment for mass production
- Extended Cluster Type of Process Module for improving production capacity
- Wafer bonding equipment for heterogeneous / homogeneous materials
- Technology that enables high performance by Wafer integration

• Machine Type : Full-Automation
• Wafer Size : 4inch(Option: 6.2inch)
• Wafer Type : Si, Sapphire, GaAs, GaN and so on.
• Bonding method : Eutectic, Adhesive, Epoxy, Polymer
• Main module : EFEM, Transfer, Stacker, Pre Aligner, Fine Aligner, Process module
• Process Module docking : Max. 3 PM Extensible
• Wafer Loading to PM Qty : 3 Wafers/PM Loading
• Application : Micro LED, Mini LED, FBAR Filter, SAW Filter, CMOS Image Sensor, MEMS, Semiconductor, Acceleration Sensor, Vertical LED